Si Silicon Wafer 8 inch Diameter 200mm Thickness 700um P Type N Type Single Polishing Double Polishing
Silicon wafers are typically cut from high-purity monocrystalline silicon rods. High-purity monocrystalline silicon rods are prepared by Czochralski process or float zone process, and then cut and polished to make silicon wafers. Common silicon wafer diameters include 3 inches, 4 inches, 6 inches, 8 inches, 12 inches, etc. Wafer thickness is generally between 0.5-0.7 mm. Silicon wafers can be doped with different impurity elements (e.g., phosphorus, boron) to adjust their electrical properties to create n-type or p-type silicon materials. This is important for the manufacture of various integrated circuits and semiconductor devices. The surface of silicon wafers needs to be polished, cleaned and other treatments to remove surface defects and contamination and ensure that the surface of the wafer is flat and smooth.
Features
1. Crystal structure: Silicon is a typical elemental semiconductor with a regular diamond crystal structure and an orderly arrangement of atoms, which provides a good basis for its electronic properties.
2. Electronic characteristics: The bandgap width of silicon is about 1.12 eV, which is between the insulator and the conductor, and can generate and recombine electron-hole pairs under the action of an external electric field, thus exhibiting good semiconductor properties.
3. Doping: Silicon can be adjusted by incorporating group III (e.g., B) or V (e.g., P, As) impurity elements to adjust its conductivity type and resistivity, providing the possibility of fabricating various semiconductor devices.
4. Oxidability: Silicon can chemically react with oxygen at high temperatures to form a dense and uniform silicon dioxide (SiO2) film, which lays the foundation for silicon-based integrated circuit processes.
5. Mechanical properties: Silicon has high hardness, strength and chemical stability, which is conducive to subsequent cutting, polishing and other processing processes.
6. Size and size: Wafers can be prepared into discs ranging from 2 inches to 12 inches in diameter to meet the needs of different processes.
Technical Parameters
Applications
1. Integrated circuits: Silicon wafers are the core carriers for the manufacture of various digital integrated circuits (such as CPUs, memories) and analog integrated circuits (such as operational amplifiers and sensors).
2. Solar cells: Silicon wafers are made into solar cell modules, which are widely used in distributed photovoltaic power generation and power supply.
3. Microelectromechanical systems (MEMS): MEMS devices such as microactuators and sensors are fabricated using the mechanical properties and microfabrication techniques of silicon materials.
3. Power electronics: Fabricate a wide range of power semiconductor devices using silicon-based high temperature tolerance and high power carrying capacity.
4. Sensors: Silicon-based sensors are widely used in electronic equipment, industrial control, automotive electronics and other fields, such as pressure sensors, acceleration sensors, etc.
Our services
1. Factory direct manufacture and sell.
2. Fast, accurate quotes.
3. Reply to you within 24 working hours.
4. ODM: Customized design is avaliable.
5. Speed and precious delivery.
FAQ
