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Specification | Value |
Glass Thickness | <1.1 mm |
Wafer Sizes | All standard up to 200 mm |
Minimum Microhole Diameter | 10 µm |
Identical Hole Diameter | 99% |
Positional Accuracy | ±3 µm |
Chipping | None |
Super Smooth Sidewalls | RA < 0.08 µm |
Hole Types | Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse) |
Hole Shape | Hourglass |
Option | Singulation from hole-processed large-sized glass |