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Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au

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China Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au wholesale
  • China Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au wholesale
  • China Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au wholesale
  • China Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au wholesale

Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au
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Brand Name :zmsh
Model Number :Gold Plated Silicon Wafers
Place of Origin :China
Payment Terms :T/T
Delivery Time :2-4 weeks
Material :Au,Silicon Wafers
Size :Customized
Thickness :Customrized
Crystalline phase :110/111/100
Process :magnetron sputtering/thermal evaporation/electroplating, etc.;
Structure :substrate + adhesive layer + plating;
Application :Grow nanomaterials,Scanning Electron Microscope (SEM)
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Product Description

Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au Vacuum Electron Beam Magnetron Sputtering Thermal Resistance Evaporation Coating

Gold-plated silicon wafer is to evenly disperse the powder obtained after oxidation of metallic gold in an aqueous solution containing binders and other additives, and then soak the silicon wafer in the aqueous solution, after a chemical reaction, the metallic gold will be closely combined with the silicon wafer to form a layer of metallic gold surface plated silicon wafer.
Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au

Features

- Excellent conductivity: The metal coating can improve the conductivity of the silicon wafer and make the electronic signal flow more smoothly.
- Strong corrosion resistance: The metal coating can prevent the silicon wafer from being attacked by chemicals and prolong the service life of the silicon wafer.
- Protection: The metal coating can protect the surface of the silicon wafer from being damaged and prevent the internal components of the silicon wafer from being damaged.
Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au

Technical Parameters

Size: 2, 4, 6, 8 inches, others can be customized;
Process: magnetron sputtering/thermal evaporation/electroplating, etc.;
Structure: substrate + adhesive layer + plating;
Substrate material: silicon wafer, quartz, BF33 glass, etc
Types of metal films: gold Au, platinum Pt, aluminum Al, copper Cu, nickel Ni, silver Ag and other metal films;
Metal film thickness: 10nm-10um; Common thickness: 100nm, 300nm, 500nm;
Uniformity is better than 1%.

Applications

1. Electronic devices: As connectors and conductive metal electrode materials, it improves the conductivity and stability of electronic components.
2. Integrated circuits: As the source and drain material of transistors, they improve the performance and life of transistors.
3. Photoelectric field: used to make solar cell electrodes to improve photoelectric conversion efficiency and stability.
4. Display device: As a cathode material, improve the display effect.
5. Chemical sensors: As sensitive materials, they are used for rapid detection and sensing of chemicals such as oxygen and toxic gases.
6. Other fields: It can also be used to make semiconductor electronic extremely low temperature controllers, chemical anti-corrosion coatings, etc.
Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au
Related product:
Si Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials AuSi Gold Plated Silicon Wafers 2inch 4inch 6inch 8inch Metal Coating Materials Au

FAQ

1. Q: What is Si gold plating?
​A: Si gold plating, that is, silicon gold plating, is a technology for gold plating on the surface of silicon materials. This technology can enhance the electrical conductivity, corrosion resistance and aesthetics of silicon materials, while also helping to improve the performance of silicon materials in some specific applications.

2.Q: What is the process of Si gold plating?
A: The process of Si gold plating usually includes three steps: pre-treatment, gold plating and post-treatment. Pretreatment is mainly to clean the surface of the silicon wafer to remove impurities such as oil and oxide; Gold plating is to deposit a layer of metal gold on the surface of the silicon wafer by electroplating, electroless plating, etc. The post-treatment is to cure and polish the gold-plated layer to improve its adhesion and aesthetics.

TAG:Si gold material,Electroplate,Chemical plating,Silicon wafer,Optical element.

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