Sapphire Wafer 3" Dia 76.2±0.1mm, Thickness 550um , C-Plane 0001 DSP SSP

Sapphire Wafer 3" Dia 76.2±0.1mm Thickness 550um C-Plane 0001 DSP SSP

The sapphire wafer, 3-inch diameters with thickness options of 550 µm, represents a cutting-edge semiconductor-grade crystalline substrate used extensively across multiple high-tech industries. Featuring a precise diameter of 76.2 ± 0.1 mm, and oriented along the C-Plane (0001), these sapphire wafers are optimized for applications requiring exceptional optical, electrical, and mechanical properties. Manufactured under stringent quality controls, these sapphire wafers offer superior purity, uniformity, and surface quality, making them ideal for cutting-edge electronics, optoelectronics, and scientific research.

Product Specifications

Applications of Sapphire Wafers

The unique properties of sapphire wafers make them suitable for a broad range of cutting-edge applications:

1. Electronics & Semiconductors
- Substrate material for GaN and other wide-bandgap semiconductors
- High-frequency devices, RF filters, and microwave components
- Substrate for micro-electromechanical systems (MEMS)

2. Scientific and Industrial

- Substrate for epitaxial growth of advanced materials
- Components in high-temperature and high-radiation environments
- Precision instrumentation and optical sensors

FAQ

Q1: What's the lead time for custom orders?

• Standard specs: 2 weeks
• Custom thickness/orientation: 4 weeks

Q2: How should wafers be stored?

• Class 1000 cleanroom
• Nitrogen-purged cassettes
• Avoid UV exposure

Q3: Do you offer smaller/larger diameters?

• 2" (50.8mm)
• 3" (76.2mm)
• 4" (101.6mm)
• 6" (150mm)
• 8" (200mm)