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Silicon Carbide SiC Wafer 4H-N 2"3"4"6"8"12" N Type Prime / Dummy / Research Grade

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Silicon Carbide SiC Wafer 4H-N 2"3"4"6"8"12" N Type Prime / Dummy / Research Grade

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Brand Name :zmsh
Place of Origin :China
Material :SiC Crystal
Type :N
Size :2/3/4/6/8/12
Thickness :500um±50um
Orientations :4.0 deg off axis + 0.5deg toward <11-20>
Surface roughness (Carbon face) :Ra < 0.5nm with Carbon face epi-ready
Resistivity :< 0.25 ohm.cm
Surface roughness (Silicon face) :Optical polished
TTV :<10um
BOW :<30um
Wrap :<30Um
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4H-N 2/3/4/6/8/12 Inch Silicon Carbide (SiC) Substrate – Prime/Dummy/Research Grade


This product series provides high-purity Silicon Carbide (SiC) substrates in multiple diameters (2", 3", 4", 6", 8", and 12"), designed for advanced semiconductor, power electronics, and optoelectronic applications. Available in Prime (device-grade), Dummy (process-testing), and Research (experimental) grades, these substrates feature excellent thermal conductivity (> 400 W/m·K for SiC), high breakdown voltage, and superior chemical stability.

The Prime Grade ensures ultra-low defect density, making it ideal for high-performance devices like MOSFETs, Schottky diodes, and RF components. The Dummy Grade offers cost-effective solutions for process optimization, while the Research Grade supports academic and industrial R&D in wide-bandgap semiconductor technologies.

With customizable specifications (doping, thickness, polishing), these substrates meet the stringent demands of power electronics, 5G communications, and electric vehicle (EV) applications.

Silicon Carbide SiC Wafer 4H-N 2


Specifications Table

Properties Specifications
Material 4H SiC
Packing Single wafer package
Type N Type
Diameter 150 mm ±0.25 mm (4 inch)
Thickness 500μm ±50 μm
Surface roughness (Carbon face) Ra ≤0.5nm with Carbon face epi-ready
Surface roughness (Silicon face) Optical polished
Orientations 4.0 deg off axis ±0.5deg toward <11-20>
MPD ≤0.5/cm² or less
TTV/BOW/Warp <10μm /<30μm /<30μm
FWHM ≤30 arc-sec or less
Primary & Secondary Flat NOT REQUIRED (No flat grinding)
Resistivity <0.25 ohm.cm


Applications of SiC Wafers

Our 4H-N substrates are engineered for cutting-edge technologies across multiple industries:

1. Power Electronics
- Electric Vehicles (EVs): High-voltage SiC MOSFETs and inverters for efficient power conversion.
- Fast Charging Systems: Enables compact, high-efficiency chargers for EVs and consumer electronics.

- Industrial Motor Drives: Robust performance in high-temperature environments.

2. RF & Wireless Communication
- 5G Base Stations: High-frequency transistors with low signal loss.
- Radar & Satellite Systems: Enhanced power handling for aerospace and defense applications.

3. Optoelectronics
- UV LEDs & Lasers: Superior thermal management for high-brightness applications.

4.Research Technologies
- Wide-Bandgap Semiconductor Research: Fundamental studies on material properties.

Silicon Carbide SiC Wafer 4H-N 2Silicon Carbide SiC Wafer 4H-N 2


Frequently Asked Questions (FAQ)

1.Can these substrates be customized in terms of doping and thickness?

Yes, we offer N-type (Nitrogen-doped) and P-type (Aluminum-doped) variants with adjustable resistivity. Thickness can range cunstomized too.

2.What is the lead time for orders?

- Standard sizes (2"-6"): 2-4 weeks.
- Large sizes (8"-12"): 4-6 weeks (subject to availability).

3.How should the substrates be stored and handled?

- Store in cleanroom conditions (Class 1000 or better).
- Handle with nitrile gloves to avoid contamination.
- Avoid mechanical stress on edges.

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