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Diamond Wire Single-Line Cutting Machine for SiC/Sapphire/Quartz/Ceramic Material
The diamond wire single-line cutting machine is a high-precision processing equipment for hard and brittle materials, utilizing diamond-impregnated wire (diamond wire) as the cutting medium to achieve efficient and low-loss cutting through high-speed reciprocating motion. This machine is primarily designed for processing hard and brittle materials such as sapphire, silicon carbide (SiC), quartz, glass, silicon rods, jade, and ceramics, including operations like cropping, truncation, cutting-off, and slicing—especially suitable for precision cutting of high-hardness and large-sized materials.
Featuring a modular design, the machine can be equipped with optional rotary worktables, high-tension systems, and circular cutting functions to meet diverse processing needs. Compared to traditional abrasive wire cutting or laser cutting, diamond wire cutting offers higher efficiency, lower material loss, and superior surface quality, making it widely applicable in industries such as semiconductors, photovoltaics, LEDs, precision optics, and jewelry processing.
| Item
| Parameter
| Item
| Parameter
|
| Maximum work size
| 600×500(mm)
| Constant tension(N)
| 15.0N~130.0N
|
| Swing angle
| 0~±12.5
| Tension accuracy(N)
| ±0.5
|
| Swing frequency
| 6~30
| Running direction
| Bidirectional or unidirectional
|
| Lift stroke(mm)
| 650(mm)
| Sliding stroke(mm)
| Maximum 500 (mm)
|
| Lift speed(mm/min)
| 0~9.99
| Storage(L)
| 30
|
| rapid travelling speed(mm/min)
| 200
| Power consumption
| 44.4kw
|
| Center Distance of Cutting Guide Wheel(mm)
| 680~825
| Mortar motor
| 0.2kw
|
| Diamond wire diameter(mm)
| φ0.12~φ0.45
| Noise
| ≤75dB(A)
|
| Running speed (m/s)
| 1500m/min
| Cutting speed
| ＜3 hours (6-inch SiC) (m/s²)
|
| Acceleration (m/s²)
| 5
| Power Line Specifications
| 4x16+1x10(mm²)
|
| Size(length/width/height)
| 2680×1500×2150(mm)
| Cutting accuracy
| <3μm(6寸SiC)(N)
|
| Weight
| 3600kg
| Gas supply Requirements
| >0.5MPa
|
The core working principles of the diamond wire single-line cutting machine include:
1. High-Efficiency Processing
2. Intelligent Operation and Flexibility
3. Modular Functional Extensions
4. Robust Structural Design
1. Semiconductor Industry
2. Photovoltaic Industry
3. Precision Optics and Jewelry
4. Research and Specialty Ceramics
With its high efficiency, precision, and low material loss, the diamond wire single-line cutting machine has become essential for hard and brittle material processing. As demand grows for third-generation semiconductors (SiC/GaN) and high-end optical components, its applications in 5G communications, electric vehicles, and photovoltaic energy will expand further. Future advancements will focus on AI-driven control and automated loading systems, steering the technology toward intelligent and unmanned operation.
1. Q: What materials can be cut with a diamond wire saw?
A: Diamond wire saws excel at cutting hard brittle materials including silicon carbide (SiC), sapphire, quartz, ceramics, and semiconductor crystals with precision up to ±0.02mm.
2. Q: How does diamond wire cutting compare to laser cutting for SiC wafers?
A: Diamond wire cutting achieves 50% faster processing of SiC with <100μm material loss versus laser's thermal damage risk and higher kerf loss.
Tag: #Diamond Wire Single-Line Cutting Machine, #Customized, #SiC/Sapphire/Quartz/Ceramic Material Processing